• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a lighting and / or signaling device comprising a plurality of light-emitting diodes (4) made integral with a plastic support (2) which has at least one three-dimensional zone in the form of staircase consisting of successive steps (18) and risers (20) in substantially perpendicular planes, each of the diodes being respectively fixed on one of the steps of said support, the diodes being fed by conductive metal tracks (6). The conductive tracks are formed by different thicknesses of metal depending on whether the tracks extend along the steps or risers, the tracks arranged on a step being made by a thickness of metal integrated in the volume of the plastic support, in housing formed in the thickness of the step, while the tracks arranged along the risers are made by a thickness of metal reported on the surface of the riser.
    公开号:FR3030687A1
    申请号:FR1462956
    申请日:2014-12-19
    公开日:2016-06-24
    发明作者:Michael Maitre
    申请人:Valeo Vision SA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to a lighting and / or signaling device of the type comprising a plurality of light-emitting diodes. It relates more particularly to the support of these light-emitting diodes and the specific three-dimensional shape of this support. In lighting and / or signaling modules, in particular for motor vehicles, light-emitting diodes are used more and more often, in particular for the advantages of space, autonomy and cost that they represent. These light-emitting diodes must be powered by electrical circuits conducting the current of a connector towards the diode. These power supply circuits can be engraved on a printed circuit board or, as is the case in more recent technology, directly injected into a plastic part to form a molded interconnecting device (MID). The use of light-emitting diodes in lighting and / or signaling modules has enabled the motor vehicle designer to bring a creative touch to the design of lighting devices. Thus, the use of several light-emitting diodes makes it possible to play on the aesthetics, as well as on the quality of the lighting of the device. The designers have also used three-dimensional parts to arrange all the diodes in a desired arrangement. Diode supports in three dimensions are thus known which have the shape of steps, each of the diodes being disposed on one of these steps being all oriented in the same direction. So that all the diodes is then fed by the power supply circuit, it is appropriate to apply the printed circuits on each of the faces of the support in three dimensions. The use of rigid printed circuit boards reported on each of the faces is not envisaged, since this implies a process of gluing the plates too tedious if the number of diodes is important. Moreover, the electrical connection between the flat plates is not ensured, and the rigidity of the printed circuit boards is hardly compatible with the desire for three-dimensional supports. It is known from EP 2 141 406 to obtain such a three-dimensional diode support and associated printed circuits by producing a molded interconnected device, the conductive tracks being integrated into the plastic injection molded part. The interconnected molded device is obtained by expensive manufacturing techniques, and which generate small metal thicknesses. However, it is important when using high power diodes to provide heat treatment with a sufficiently large metal thickness. The techniques previously used for producing the molded interconnected device, such as galvanizing each of the faces of the diode support and then etching these faces by laser ablation, do not make it possible to obtain such thicknesses of metal. Flexible printed circuits are also known, manufactured using a printed circuit technology which consists of using a plastic substrate on which the circuits are screen printed. These flexible printed circuits are adapted to take a particular shape for their optimized integration into the lighting and / or signaling module. The main problems of this type of realization is their cost, which is not compatible with the requirement of low cost of large series applications, as well as their lower resistance. The present invention provides a diode support in three dimensions, obtained by inexpensive manufacturing operations, simple to set up, and which generates a diode support with high cooling capacity of the diodes. For this purpose, the invention proposes a lighting and / or signaling device comprising a plurality of light-emitting diodes made integral with a plastic support which has at least one three-dimensional zone in the form of a staircase composed of steps and successive risers in substantially perpendicular planes. The diodes are each fixed on one of the steps of the support, and they are powered and controlled by conductive metal tracks. According to particularly advantageous features of the invention, the conductive tracks are formed by different thicknesses of metal depending on whether they extend along the steps or along the risers. Thus, the tracks arranged on a step around a light-emitting diode are made by a thickness of metal injected into the volume of the plastic support, in notches or furrows formed in the thickness of the step, whereas the tracks arranged on the Long risers are made by a thicker metal reported on the surface of the riser. The tracks made on the steps around the light-emitting diode are made by hot pressing a metal sheet on each of these steps while the tracks along the risers are obtained by any other means. Thus, it is advantageous to combine the hot-pressing of a metal foil in the plastic support, according to a so-called "hot-embossing" method, which makes it possible to carry out important metallization layers, that is to say in depth and integrated into the volume of the diode support, where they are needed, that is to say in the vicinity of the light-emitting diode which requires this heat treatment, with other manufacturing techniques for the integration of printed circuits in the risers, which do not carry a diode and have only a geometric function. According to various features of the invention, it can be envisaged that the conductive tracks reported on the risers can be either by a MID technology, such as galvanization and laser ablation, since this surface does not support the diodes does not require a metallization thickness important, either by simple connectors allowing the electrical interconnection of each of the steps between them. A lighting and / or signaling device is thus proposed which makes it possible to meet the architectural expectations of car designers, since the diode support is in three dimensions, with a lower cost of producing the support for diodes and integrated circuits. that of a technique of integral galvanization of the support for example, and having an increased resistance compared to the achievements with the flexible printed circuit techniques. According to various features of the invention: the tracks arranged along the risers are attached to the risers by ink injection. In this type of embodiment, it is advantageous to produce droplets at the junction between the steps and the risers to form an electrical continuity between the tracks arranged on the steps and the tracks arranged on the risers. the thickness of metal injected into the plastic material forming the steps is greater than the thickness of metal added to the plastic surface forming the risers. the diodes and the conductive tracks are arranged on the same face of the diode support. the steps, and respectively the risers, are arranged so as to extend in substantially parallel planes with respect to one another. The invention also relates to a lighting and / or signaling module comprising a housing closed by a protective glass and inside which are fixed a three-dimensional diode support such as has just been presented and a reflector adapted to orient the light beam from the diodes in the desired direction at the output of the module. The diode support has a front face oriented opposite the reflector and on which the diodes are reported. Again, these diodes are connected by conductive electrical tracks made in two different ways in that they are integrated into the material at the level of the carrier steps of the diodes and which are reported on the front face at the risers. The invention furthermore relates to a method for obtaining a lighting and / or signaling device having a three-dimensional plastic support for a plurality of light-emitting diodes, in which the conductive paths for supplying the diodes are injected into the material in two different ways depending on whether these tracks extend along the steps or along the risers. The tracks made on the steps around the light-emitting diode are made by stamping the support and hot pressure of a metal foil in housings formed in the volume of the support by stamping, and the tracks made along the risers are obtained by any other means, for example by a conductive ink deposit. Advantageously, the realization of the tracks injected into the material of the support at the steps and the realization of the tracks by conductive ink deposition along the risers are performed in two successive operations, the three-dimensional plastic support being rotated between these two operations so that the realization of the tracks injected into the material of the support at the steps is carried out in a given plane and that the realization of the tracks by conductive ink deposition along the risers is carried out in a substantially perpendicular plane. According to a characteristic of the invention, these process steps are then followed by the connection of the diodes on each of the steps of the support on which the printed circuit has been injected by hot pressing of a sheet. Thus, the metallization of the entire support is carried out in two successive steps for which access to the part is each time facilitated by the change of axis. It is understood that the diode support has steps of flat shape sufficiently large to correctly perform the step of hot printing of the sheet on the steps of the support, and it is understood that the risers are intended to be metallically coated during the second interconnection step which requires the deposition only of a weak layer of metal, the heat treatment obligation of the heat released by the light-emitting diode being mainly supported by the metal layer disposed on the flat part of the steps . The invention and the advantages resulting therefrom will be described in the detailed and nonlimiting description which follows, and which will be made with reference to the appended drawings, among which: FIG. 1 is a perspective view of a device of FIG. lighting and / or signaling according to the invention, associated with a reflector; FIG. 2 is a perspective view of the device of FIG. 1, seen from the other side and in which the diode support, provided with the diodes and printed circuits for powering these diodes, is distinguished, and FIG. 3 is a diagrammatic representation in section of a detail of the diode support illustrated in FIG. 2, showing in particular two light-emitting diodes from the supported plurality, as well as the conductive tracks associated with these two diodes and their interconnections. The lighting and / or signaling device according to the invention comprises a diode support 2 in three dimensions, on which a plurality of light emitting diodes 4 are connected, each connected by electrically conductive tracks 6 for transmitting the power supply and the electroluminescent diode 4. ordering information. The device is particularly adapted to be housed in a lighting module and / or signaling motor vehicles formed of a housing housing the diode support and a projection glass closing the housing and trap the support. In addition, as illustrated in FIG. 1, the diode support is adapted in this lighting and / or signaling module to be arranged facing a reflector 8, which will make it possible to obtain the final orientation desired light beam from the light emitting diodes. The diode support has a front face 10, turned towards the reflector, the diodes being each arranged on plane portions of this front face so that the light beam at the output of each of the diodes is directed towards the wall of the reflecting reflector. It is understood that the support, the light-emitting diodes and the projector are arranged so that the light emitted is in the direction of the projection glass, to illuminate or signal to the outside of the vehicle. For this purpose, in known manner, the assembly formed by the reflector and the diode support is arranged so that each of the diodes is disposed on a focus of the reflector. Indexing means are carried respectively by the support and by the reflector to ensure the position of the diodes on these homes. Lateral pins 12 and lugs 14 (visible in FIG. 1) protrude from the main plane of the reflector and corresponding notches 16 (visible in FIGS. 1 and 2) are formed in the walls of the diode support to form these indexing means. It is ensured that the presence of the walls carrying pawns and lugs does not interfere with the light scattering at the output of the diodes.
    [0002] The diode support of the device according to the invention has a three-dimensional zone in the form of a staircase, comprising a succession of steps 18 and risers 20 arranged in substantially perpendicular planes. As illustrated in FIG. 2, the diode support can be defined by several series of steps 22 arranged below one another. Referring to the longitudinal emission direction of the diodes disposed on the support, we will speak later of an arrangement of the steps in a transverse plane, and an arrangement of the risers in a longitudinal plane. The light-emitting diodes are arranged one by one on the steps, one diode per step. The diodes are fixed by gluing on the front face of the diode support. The steps are arranged in planes parallel to each other, so that the beams from the diodes extend substantially parallel in the same direction. It will be understood that the design of the support piece can be modified without departing from the context of the invention, and have, for example, more or less steps and therefore more or fewer light-emitting diodes. However, it is appropriate according to the invention that each of the steps adapted to receive a light emitting diode has a surface, on which is reported the diode, which is sufficiently flat. The conductive tracks for diode supply and for the communication of lighting control instructions extend continuously over the entire support, from one step to another, through the risers. According to the invention, as can be seen in FIG. 3, the diode support is particular in that the conductive tracks are formed by different thicknesses of metal depending on whether they are applied on the steps or on the risers, and in that the conductive tracks extend into the volume of the plastic part, as injected into the material, or on the surface of this plastic part, as deposited on the material, again depending on whether they are applied to the steps or on the risers. Indeed, if it is true that the metal tracks are conductive continuously throughout the circuit, it is observed that the thickness of metallization used for the realization of these tracks in or on the plastic material of the support is different depending on that it is applied to steps or risers. The thickness of metallization is greater on the steps, that is to say near each of the light emitting diodes, than on the risers. As has been previously stated, the metal serves both for the communication of information from the control module to each of the diodes distributed on the diode support, and it also serves to cool the diodes, the effectiveness of which it being proportional to the thickness of the metal present in the vicinity of the diode. The larger the thickness of the metal, the better the cooling. This large thickness of metal on the steps is obtained by the hot pressure of a metal film of the desired thickness, hence the need for correct flatness of the step forming the receiving face of the diode. The hot pressure of the metallic film on the step is made according to a technique known by the name of "hot embossing", wherein a metal sheet having the desired thickness of metal is disposed against each of the steps. The first step of this technique is to place the blank plastic support in a frame reproducing the three-dimensional staircase shape of the support, so that it can bear against the frame and keep a sufficient rigidity during the pressure stage to come . The frame is oriented adequately so that the plastic support has apparent, and appropriate to the deposition of the metal sheet, the front face of each of the steps. The metal sheet is deposited on the steps, on the front face adapted to receive thereafter the diode. It is possible to provide only a single metal sheet covering the entire support, or to provide separate metal sheets specific to each of the steps and the drawing of the tracks that one wishes to achieve on these steps. A press is then applied against the diode support by trapping the (or) sheet (s) metal (s). The face of the press brought to come into contact with the metal sheet has ribs which project from this face in a disposition corresponding to the arrangement of the conductive tracks which it is desired to integrate on the steps of the diode support. . Without departing from the context of the invention, it is possible to provide a press having a two-dimensional plane contact face which is attached to each of the steps and which creates for each the same arrangement of tracks, or a press having a three-dimensional contact face. which deforms all the steps in a single strike, this being possible by the parallel arrangement of the planes in which the steps extend. The movement of the press stops when the contact face is in abutment against the front face of the support. The ribs projecting from the contact face then deform the front face of the support at the steps creating slots 24 in the form of grooves or notches (shown in Figure 3) of dimensions and arrangement corresponding to those ribs. As will be illustrated by way of example, it will be understood that the housings formed on one and the same step may have different dimensions and depths, in particular as a function of their proximity to the light-emitting diode adapted to be stuck on this step. and that the corresponding ribs formed protruding on the press may in fact take different shapes and dimensions to each other. By this hot pressure, the metal sheet is deformed to follow the descent of the press and is pressed into the thickness of the support in each of the grooves created. It is then necessary to remove the surplus of the metal sheet which is not found integrated in the volume of the diode support. This hot pressing technique, conventionally used for two-dimensional parts, is here combined with another method for producing electrically conductive tracks on the risers and ensuring electrical continuity between the printed circuits reported on the steps. This other method can be chosen from several known techniques, being understood that the requirement of a large thickness of metal only applies to the deposition of metal on the steps. As illustrated in FIG. 3, this electrical continuity is advantageously achieved by depositing a conductive ink layer 26 on the risers. This makes it possible to control the effective deposition surface of conductive tracks and to limit it solely to the function of electrical continuity of the tracks injected into the volume of the steps, since there is no need here to ensure a cooling function of the diodes. . In addition, the ink deposition technique makes it easy to form the junctions between the perpendicular planes by the formation of drops in excess thickness 28. As a result, at the steps, the tracks are integrated in the volume of the diode support. , injected into the support, while at the risers, the tracks are pressed against the front face of the support, extra thickness. As has been previously described, the tracks integrated in the volume of the support advantageously have a thickness greater than that of the tracks pressed against the support. It has previously been observed that the steps receiving the diodes, and therefore carried out by the same method of hot pressing, are all substantially parallel and arranged in the same transverse plane. The hot pressing can thus be performed as described above, in one operation or in as many operations as there are steps but without moving the support piece. This is particularly advantageous since the production costs of the machine are limited. It then suffices in the method of embodiment of the device according to the invention to turn the machine when all steps carrying diodes are injected with electrical circuits, so that it is then carried out in a same continuous step the deposition of conductive layers to achieve the interconnections on the risers. The description which has just been made clearly explains the advantages of the invention, in particular the reduction of the costs of obtaining the part, three-dimensional to meet the requirements of the car manufacturers. The combination of two methods of producing injection or deposition of metallic elements with respect to a plastic part, chosen correctly according to the application zone of these electrical circuits, makes it possible to avoid excessive manufacturing costs of a chemical bath in which one could consider dipping the plastic support part in its entirety and it also avoids obtaining a piece with too small metal thicknesses on its entire metallized face, which could generate a overheating of the room and failure of the lighting and / or signaling device. It is particularly advisable to use the so-called "hot-embossing" methods for the flat surfaces carrying the diodes, and to associate this method of realization with a more conventional, less expensive method and generating less metal for the zones d interconnections. It should be noted that the technique of "hot-embossing" is known to be effective on parts in two dimensions, so that the skilled person would not have interest, unless to imagine the use of this technique in combination with other techniques for the metallization of the interconnections, to use this technique in the context of a three-dimensional support.
    权利要求:
    Claims (4)
    [0001]
    REVENDICATIONS1. Lighting and / or signaling device comprising a plurality of light-emitting diodes (4) made integral with a plastic support (2) which has at least one three-dimensional zone in the form of a stairway composed of steps (18) and risers (20) successive in substantially perpendicular planes, each of the diodes being respectively fixed on one of the steps of said support, the diodes being fed by conductive metal tracks (6), characterized in that the conductive tracks are formed by thicknesses of different metal depending on whether the tracks extend along the steps or along the risers, the tracks arranged on a step around a light-emitting diode being made by a thickness of metal injected into the volume of the plastic support, in housings ( 24) formed in the thickness of the step, whereas the tracks arranged along the risers are realized by a su metal thinner reported on the surface of the riser.
    [0002]
    2. Device according to claim 1, characterized in that the tracks (6) arranged on a step (18) around a light-emitting diode (4) are formed by the hot pressure of a metal sheet on the step while the tracks arranged along the risers (20) are made by any other means so as to allow the continuity of the electrical conduction between each of the steps.
    [0003]
    3. Device according to claim 1 or 2, characterized in that the tracks (6) arranged along the risers (20) are reported on the risers by injection of an ink layer (26).
    [0004]
    4. Device according to claim 3, characterized in that drops extra thickness (28) are formed at the junction between the steps (18) and risers (20) to form an electrical continuity between the tracks arranged on the steps and the tracks arranged on the risers. . Device according to one of the preceding claims, characterized in that the thickness of the metal injected into the plastic material forming the steps (18) is greater than the thickness of the metal applied to the surface-forming plastic material of the risers (20). . 6. Device according to one of claims 1 to 5, characterized in that the diodes (4) and the conductive tracks (6) are arranged on the same face (10) of the diode support (2). 7. Device according to claim 1, characterized in that the steps (18) are arranged to extend in substantially parallel planes relative to each other. 8. Device according to claim 1, characterized in that the risers (20) are arranged to extend in parallel planes relative to each other. 9. Lighting and / or signaling module comprising a housing closed by a protective glass and inside which are fixed a three-dimensional diode support (2), comprising a succession of steps (18) and risers (20). ), as well as a reflector (8), characterized in that the diode support having a front face (10) oriented opposite the reflector and on which a plurality of light-emitting diodes (4) is attached, said diodes being connected by conductive electrical tracks (6) which are integrated into the material at the level of the diode carrying steps and which are attached to the front face at the risers. 10.Procedure for obtaining a lighting and / or signaling device having a three-dimensional plastic support (2) for a plurality of light-emitting diodes (4) according to one of claims 1 to 8, wherein the conductive tracks (6) diode supply are injected into the plastic material in two different ways depending on whether these tracks extend along the steps (18) or along the risers (20), the tracks made on the steps around the electroluminescent diode being made by stamping the support and hot pressure of a metal foil in the housings (24) formed in the volume of the support while the tracks along the risers are obtained by any other means. 11.Procédé according to claim 10, wherein the realization of the tracks (6) reported along the risers (20) is performed by a conductive ink deposition (26). 12.Procédé according to claim 11, wherein the realization of the tracks (6) injected into the material of the support at the steps (18) and the realization of tracks by conductive ink deposition along the risers (20) are performed in two successive operations, the three-dimensional plastic support (2) being rotated between these two operations so that the realization of the tracks injected into the material of the support at the steps is carried out in a given plane and that the realization of the tracks by deposit of conductive ink along the risers is carried out in a substantially perpendicular plane.
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    同族专利:
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    引用文献:
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    法律状态:
    2015-12-31| PLFP| Fee payment|Year of fee payment: 2 |
    2016-06-24| PLSC| Publication of the preliminary search report|Effective date: 20160624 |
    2016-12-29| PLFP| Fee payment|Year of fee payment: 3 |
    2018-01-02| PLFP| Fee payment|Year of fee payment: 4 |
    2019-12-31| PLFP| Fee payment|Year of fee payment: 6 |
    2020-12-31| PLFP| Fee payment|Year of fee payment: 7 |
    2021-12-31| PLFP| Fee payment|Year of fee payment: 8 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1462956A|FR3030687B1|2014-12-19|2014-12-19|ILLUMINATING AND / OR SIGNALING DEVICE COMPRISING A PLURALITY OF LIGHT EMITTING DIODES|FR1462956A| FR3030687B1|2014-12-19|2014-12-19|ILLUMINATING AND / OR SIGNALING DEVICE COMPRISING A PLURALITY OF LIGHT EMITTING DIODES|
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    US14/974,307| US20160178151A1|2014-12-19|2015-12-18|Lighting and/or signaling device comprising a plurality of light-emitting diodes|
    CN201510962711.1A| CN105722306A|2014-12-19|2015-12-21|Lighting And/Or Signaling Device Comprising A Plurality Of Light-Emitting Diodes|
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